friedhof:beta-layout:pcbprinter:experiments
pcb-printer: Experiments
- Use etch-resist ink as solder mask
- can you solder using a soldering iron?
- can you solder using the reflow oven? (might get too hot)
- Get etch resist to NOT FUCKING FLAKE OFF THE STUPID PCB DURING ETCHING GRAAAAAAHHH! *rage*
- RESULTS: Use Fe3Cl, not NaPS. All other attempts led to epic failage.
- Tried a couple of curing temperatures (temp setting on reflow oven) and times, here are my results:
| 100 ðC | 150 ðC | 170ðC | 180 ðC | 200 ðC | |
|---|---|---|---|---|---|
| 4min | FAIL! | FAIL | FAIL | OKish | |
| 6min | FAIL | FAIL | |||
| 8min | FAIL | FAIL | OKish | ||
| 10min | FAIL |
- „OKish“ means the resist still flaked off, but stuck to the board relatively long.
- An attempt to print on a pre-heated PCB and curing for 4min at 170 ðC gave the best results so far (though not perfect), but the hot PCB warped the plastic carrier beyond repair =( A routed aluminium carrier with integrated heating could work.
friedhof/beta-layout/pcbprinter/experiments.txt · Zuletzt geändert: 2020-07-20 10:10 von neos